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general description the DS3900H2 evaluation kit (ev kit) component provides bidirectional communication with i 2 c- and spi-compatible devices using a pcs usb port. in addition, the ev kit can also be used as a general-purpose digital i/o interface with 11 i/o signals that can evaluate a variety of ics. the DS3900H2 ic is a small form-factor module that requires appropriate headers to pass communication signals to the device under test. the ic is intended to interface with approved hid-compliant pc software designed by maxim integrated. the ic is intended for evaluation purposes only. ev kit contents assembled DS3900H2 circuit board mini-usb cable features communicates from pcs to ics through a usb port using the human interface device (hid) class fast communication to i 2 c- and spi-compatible devices 11 total general-purpose digital i/o pins, including all communication protocol pins built-in pullup resistors for sda and scl minimize required external hardware connection to standard prototyping boards possible using header connectors operates from +2.5v to +5.5v usb hid interface for windows xp ? -, windows vista ? -, and windows ? 7-compatible software rohs compliant fully assembled and tested proven pcb layout 19-6733; rev 0; 6/13 ordering information appears at end of data sheet. windows, windows xp, and windows vista are registered trademarks and registered service marks of microsoft corporation. DS3900H2 ev kit photo DS3900H2 usb hid communications module for evaluation kits
maxim integrated 2 note: indicate that you are using the DS3900H2 when contacting these component suppliers. designation qty description c1, c6, c7, c13 4 1.0f ceramic capacitors (0603) tdk cgj3e2x7r0j105k c2, c5, c15 3 4.7f ceramic capacitors (0603) tdk c1608x5r0j475k c3, c8, c10, c11, c14, c16 6 0.1f ceramic capacitors (0603) tdk c1608x7r1e104k c4, c9 2 0.01f ceramic capacitors (0603) tdk cgj3e2x7r1c103k c12 1 220nf ceramic capacitor (0603) tdk c1608x7r1a224k d1 1 red led (1206) kingbright aptr3216ec d2 1 red/green dual leds kingbright aphb m2012surkcgkc d3 1 schottky diode rohm semi rb060m-30tr j1 1 5-pin mini-usb female connector molex 54819-0519 j2 0 do not populate, 2-pin header j3, j4 2 create a solder bridge across the two pads q1 0 do not populate, n-channel mosfet on semi nts4001nt1g designation qty description r1, r2 2 25? 1% resistors (0603) vishay crcw060324r9fkea r3, r8, r9 3 330? 1% resistors (0603) vishay crcw0603330rfkea r4, r5 2 10k? 1% resistors (0603) vishay crcw060310k0fkea r6 1 100k? 1% resistor (0603) vishay crcw0603100kfkea r7, r11, r12 3 4.7 k? 1% resistors (0603) vishay crcw06034k70fkea r10 1 2.2k? 1% resistor (0603) vishay crcw06032k20fkea u1 1 microchip pic18lf2550-i/so u2 1 fxma108 fairchild fxma108bqx u3 1 usb transceiver (16 tssop) maxim max3344eeue+ u4 1 linear regulator (5 sot23) maxim max8868euk33+ u5 1 current-limit switch (5 sot70) maxim max4787exk+ u6 2 16-pin (2 x 8) header (hdr2x8) sullins pptc082lfbn-rc x1 1 4-pin cmos oscillator avx kc3225a48.0000c30e00 supplier phone website avx north america 864-967-2150 www.avx.com fairchild semiconductor 888-522-5372 www.fairchildsemi.com kingbright corporation 909-468-0500 www.kingbrightusa.com molex 800-786-6539 www.molex.com on semiconductor 602-244-6600 www.onsemi.com rohm co., ltd. 858-625-3630 www.rohm.com sullins electronics corp. 760-744-0125 www.sullinselectronics.com tdk corp. 847-803-6100 www.component.tdk.com vishay 402-563-6866 www.vishay.com component list component suppliers DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
maxim integrated 3 quick start required equipment DS3900H2 ev kit hardware (included) mini-usb cable (included) user-supplied windows xp, windows vista, or windows 7 pc with a spare usb port user-supplied +2.5v to +5.5v power supply (300ma minimum) approved previously designed hid-compliant gui designed by maxim integrated DS3900H2 breakout board or a previously purchased compatible maxim integrated ev kit setup procedure the ev kit communicates with ics using a pcs usb port. it utilizes a max3344e usb transceiver (u3) to convert logic-level signals to usb signals, and usb signals to logic-level signals acceptable for the microprocessor. the microprocessor is then able to communicate to the pc by using its full-speed-compatible usb serial interface engine. the usb interface of the ic hardware is config - ured as an hid device and therefore does not require a unique/custom device driver. once powered and properly connected to a pc through a usb cable, windows should automatically begin installing the necessary device driv - er. once the driver installation is complete, a windows message appears near the system icon menu indicating that the hardware is ready to use. after the hardware is ready to use, open an approved hid-compliant graphical user interface (gui) designed by maxim integrated. the gui then sends commands of various lengths over the usb connection. this provides instruction and data for the ic to communicate with the i 2 c- and spi-compatible devices, or to read or write a specific pin of the ic. all of the pins, with the exception of p3, have three-state driv - ers. since the ic is rated to work with supply voltages ranging from +2.5v to +5.5v, the ev kit operates from the same voltage supply as the ic that it is controlling. figure 1. DS3900H2 functional diagram usb max4787 current switch d1 fault d+, d- 8 vusb m a x3 3 4 4e u s b t r a n sce i ve r 48mhz oscillator b id i r e ct i o n a l l e ve l t r a n sl a t o r m i cr o p r o ce sso r p3-pulse h b/p3 p11 p10 p1 p2 p4 p5 mclr p11-(sda) p10-(scl) d2 red com 3800? r11 vdut vdut 9 8 vdut r12 4.7k? vdut p1, p2 p4-p9 mclr max8868 3v3 ldo 3v3 3v3 3v3 3v3 vdut vdut d2 green pulse m i n i-u s b c a b l e hid class pc p6 p7 p8 p9 v cc gnd gnd e x t e r n a l p o w e r s u p p l y r e q u i r e d gnd d s3900h2 u s b m odul e ds900h2 pins detailed description of hardware DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
maxim integrated 4 table 1. recommended operating conditions table 2. pin description note 1: all voltages listed are with respect to ground. note 2: devices are only functionally tested; parameters listed not guaranteed. parameter symbol conditions min typ max units supply voltage v cc +2.5 +5.5 v supply current 30 ma input low voltage v il i/o pins p1Cp11 0.15 x v cc v input high voltage v ih i/o pins p1Cp11 0.25 x v cc + 0.8v v output high voltage v oh i/o pins p1Cp11, i oh = -3.0ma v cc - 0.7 v output low voltage v ol i/o pins p1Cp11, i ol = 8.5ma +0.6 v ambient temperature t a -40 +85 c i 2 c clock frequency 100 400 khz spi clock frequency 186 750 3000 khz pin function i 2 c spi p1, p2, p4, p5, p7, p8 general-purpose bit i/o with three-state i/o pin (input, push-pull output driver). hb/p3 pulse or general-purpose bit i/o with open-drain i/o pin (input, open drain) output driver. p6 general-purpose bit i/o with three-state i/o pin (input, push-pull output driver). p6 ce (push-pull output driver when used as ce) or general-purpose bit i/o with three-state i/o pin (input, push-pull output driver). p9 general-purpose bit i/o with three-state i/o pin (input, push-pull output driver). p9 mosi (push-pull output driver when used as mosi) or general-purpose bit i/o with three-state i/o pin (input, push-pull output driver). p10 scl (open-drain output when used as scl) or general-purpose bit i/o with three-state i/o pin (input, push-pull output driver). p11 sda (open-drain output or input when used as sda) or general-purpose bit i/o with three-state i/o pin (input, push-pull output driver). p10 sck (push-pull output driver when used as sck) remove built-in pullup resistor r12 or general- purpose bit i/o with three-state i/o pin (input, push-pull output driver). p11 miso (input when used as miso) remove built-in pullup resistor r11 or general-purpose bit i/o with three-state i/o pin (input, push-pull output driver). mclr do not connect (reset for microprocessor). gnd ground terminals. all three ground terminals must be connected to ground for operation. v cc power-supply terminal. external power supply (vdut) required. (typical values are at v cc = 3.3v, t a = +25c, unless otherwise noted.) (notes 1 and 2) DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
maxim integrated 5 designing hardware to utilize the built-in support for i 2 c devices the ic has custom firmware that utilizes either a master synchronous serial port (mssp) of the microcontroller configured in i 2 c mode, or several bit-banging routines with clock-stretching support. these two modes of opera - tion are configured through the evaluation software. to utilize the i 2 c firmware, connect the scl bus to p10 and the sda bus to p11, as shown in figure 3. the ic has built-in pullup resistors (r11, r12) that connect 4.7k resistors to both i 2 c buses. upon initial power-up, the ic configures itself in i 2 c mode using the mssp block of the microcontroller at scl clock speed of 400khz. note that most evaluation software configures the ic to the desired communication protocol upon initial software execution and during all usb recon - nects of the ic. for designs that only use the ic to communicate to i 2 c devices, the following items must be accounted for in the hardware design: place the mating connectors on the circuit board (see figure 5). connect v cc and all three gnd ground terminals. connect the scl bus to pin p10, and the sda bus to p11 of the ic. drive the ic with evaluation software provided by maxim integrated. figure 2. DS3900H2 pin configuration p11 p10 gnd v cc p9 p8 p7 p6 p1 p2 hb / p3 mclr gnd p4 p5 gnd DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
maxim integrated 6 designing hardware to utilize the built-in support for spi devices the ic has custom firmware that utilizes a master synchronous serial port (mssp) of the microcontroller configured in spi mode, which allows fast communication to spi devices. to utilize this firmware, connect ce to p6, the miso bus to p11, the mosi bus to p9, and the sck bus to p10, as shown in figure 3. the ic has built-in pul - lup resistors (r11, r12) that connect 4.7k resistors to both miso and sck; this is not applicable for spi com - munication and must be removed. for designs that only use the ic to communicate to spi devices, the following items must be accounted for in the hardware design: place the mating connectors on the circuit board (see figure 5). connect v cc and all three gnd ground terminals. connect ce to p6, the miso bus to p11, the mosi bus to p9, and the sck bus to p10 of the ic. remove the built-in pullup resistors (r11, r12). drive the ic with evaluation software provided by maxim integrated. designing hardware to utilize the general- purpose bit i/o signals utilizing the ic for general-purpose bit i/o is equally simple as using it for i 2 c and spi applications. all the i/o pins with the exception of p3 have three-state outputs. these signals can be written to a 0 or a 1 and can be read as inputs. p3 has an open-drain output and can be read as an input pin as well; however, its default function is a system pulse that provides a visual indication, through the attached led, that the ic is operating properly (see figure 7). the p3 pin defaults to a slow-pulsing output that can be disabled, but designs using p3 for i/o should be con - scious that the ic could attempt to blink p3 before the pulse function is disabled. as long as the ic connected to p3 is tolerant of this behavior, p3 can be used as an additional i/o. when using p3 as an i/o pin with the attached led, writing it to a 1 turns off the pulldown transistor, which turns the led off, and writing it to a 0 turns the pulldown and the led on. figure 3. DS3900H2 typical i 2 c operating circuit usb m i n i-u s b c a b l e hid class pc p1 p2 hb / p3 mclr gnd p4 p5 gnd p11-sda p10-scl gnd vdut* r12 v cc v cc gnd scl i 2 c bus i 2 c device #1 v cc p9 p8 p7 p6 usb module DS3900H2 r11 v cc sda v cc gnd scl i 2 c device #2 sda * v d u t a n d g n d m u st b e p r o vi d e d f r o m e xt e r n a l su p p l y. DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
maxim integrated 7 additionally, designs using p10 and p11 as general i/o should be conscious of the built-in pullup resistors intend - ed for use with i 2 c devices (see figure 7). the general procedure for connecting the ic for bit i/o applications is as follows: place the mating connectors on the circuit board (see figure 5). connect v cc and all three gnd ground terminals. connect p1 through p11 to the application. if the application is using i 2 c devices in addition to the remaining bit i/o signals, make sure to reserve p10 and p11 for the i 2 c application. if the application is using spi devices in addition to the remaining bit i/o signals, make sure to reserve p6, p9Cp11 for the spi application. use p3 only if the application is able to tolerate the pulse function until it is disabled. drive the ic with evaluation software provided by maxim integrated. figure 4. DS3900H2 typical spi operating circuit usb m i n i-u s b c a b l e ** hid class pc p1 p2 hb / p3 mclr gnd p4 p5 gnd p11-miso p10-sck gnd vdut* r12 v cc ce sck mosi miso v cc spi device v cc p9-mosi p8 p7 p6-ce usb module DS3900H2 r11 v cc gnd * v d u t a n d g n d m u st b e p r o vi d e d f r o m e xt e r n a l su p p l y * * p u l lu p s r1 2 and r 1 1 m u st b e r e m o ve d f o r s p i DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
maxim integrated 8 figure 5. recommended pcb connection for DS3900H2 0.025in, 16 places 0.1 0 0in 0.025in 16 places 0.1 0 0in 8 pl ac es 0.2 4 0in,1 6 p l a c e s 1.2 0 0in DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
maxim integrated 9 figure 6. DS3900H2 dimensions note: the ic mates with standard 2.54mm (0.100in) 2 x 8 male header connectors. these connectors do not come standard with the board. table 3. description of leds t op f r ont s i de 0.5 7in 0.4 0 0in 0.3 3 5in 1.2 2in 1.1 4 7in 0.8 1 5in 0.1 0 0in 0.0 2 5in 0.1 5 5in 0.3 3 5in 0.4 0 0in 0.5 7in 0.1 0 0in 1.2 0 0in 0.0 2 5in 0.3 0 5in 1.3 2 9in 1.300in 1.370in led color description d1 (fault) red usb power fault: a fault occurred due to overvoltage limit, current limit, or thermal limit. d2 (com) red communication: after the software has initialized the hardware, the led fashes red when a command from the pc is received. red and fashing orange waiting: hardware is powered on and waiting for the software to be opened. DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
maxim integrated 10 troubleshooting all efforts have been made to ensure that the ic works on the first try, right out of the box. in the rare occasion that a problem is suspected, see table 4 to help troubleshoot the issue. table 4. troubleshooting symptom check solution windows does not detect hardware is the led labeled d1 on the DS3900H2 red? if yes, then the electronic fuse is in a fault state. inspect for electrical shorts on the pcb and make sure that the pcb is not sitting on a conductive surface. usb cable and port try connecting the usb cable to a different usb port on the pc and wait for a windows message that indicates that the hardware is ready to use. if the device is not detected, unplug the usb cable and reboot the pc. connect the usb cable. are any of the leds illuminated? if not, then the pcb may not be getting power. make sure bias is applied to v cc and all three gnd terminals are connected to system ground. verify that the usb cable is connected to a pc. DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
maxim integrated 11 figure 7. DS3900H2 ev kit communications module schematic mcl r 1 p 3,hb 2 com_l ed,boot 3 p 1 4 p 2 5 rcv 6 p 6, cs 7 gnd 8 osc1 9 osc2 10 p 4 11 uoe 12 p s_var 13 vusb 14 d - ,vm 15 d+,vp 16 enum 17 p 9,sdo 18 gnd 19 vdd 20 p 11,sdi ,sda 21 p 10,sck , s c l 22 vmo 23 v p o 24 usb_de t 25 p 5 26 p 7,1w_dq 27 p 8,1w _ p u 28 u 1 p i cfor ds3900 vbus 1 d - 2 d + 3 i .d. 4 gnd 5 j 1 usb_5p i n out 1 gnd 2 f l a g 3 o n 4 i n 5 max4787exk +tct- n d u 5 max4787 shdn 1 gnd 2 i n 3 out 4 b p 5 u 4 max8868euk 33- t d 1 l e d r 3 330 r 1 25 r 2 25 r 8 330 r 9 330 r10 2.2k r11 4.7k r12 4.7k c 5 4.7uf c14 0.1uf c13 1.0uf c 2 4.7uf c 3 0.1uf c 1 1.0uf c12 220nf c 4 0.01uf gnd gnd d - d + vbus gnd 5 v gnd 3.3v rcv 1 v p o 2 mode 3 vmo 4 o e 5 susp 6 v p i 7 vmi 8 enum 9 v c c 10 gnd 11 d - 12 d + 13 vtrm 14 v l 15 usb_de t 16 u 3 max3344e vcca 1 a 0 2 a 1 3 a 2 4 a 3 5 a 4 6 a 5 7 a 6 8 a 7 9 gnd 10 o e 11 b 7 12 b 6 13 b 5 14 b 4 15 b 3 16 b 2 17 b 1 18 b 0 19 vccb 20 u 2 f xma108 rcv 3v3 v p o 3 v 3 vmo 3v3 oe 3v3 v p i 3v3 vmi 3v3 usb_det 3v3 d + d - e num 3v3 gnd 3.3v 5 v c 6 1.0uf c 7 1.0uf c 8 0.1uf gnd 3.3v vtrm 3.3v vdut c10 0.1uf c11 0.1uf gnd e num 3v3 vmi 3v3 oe 3v3 vmo 3v3 v p o 3 v 3 rcv 3v3 usb_det 3v3 v p i 3v3 usb_det vdut rcv vdut v p o vdut vmo vdut oe vdut v p i vdut vmi vdut enum vdut r 5 10k gnd gnd r 6 100k r 4 10k gnd gnd vdut vdut oe vdut rcv vdut usb_det vdut v p o vdut vmo vdut enum vdut v p i vdut vmi vdut vdut gnd p 9 p 5 p 7 p 8 p 6 p 1 p 2 p 4 gnd scl sda c15 4.7uf c16 0.1uf r 7 4.7k 1 2 j 2 gnd v p p h b c o m c l k 3v3 c 9 0.01uf 3.3v gnd c l k vdut vdut c l k vdut i n h 1 gnd 2 out 3 v c c 4 x 1 osc_cmos_4pi n p 1 p 2 h b v p p p 4 p 5 sda scl p 9 p 8 p 7 p 6 gnd vdut vdut gnd p 1 1 p 2 2 hb/ p 3 3 mcl r 4 gnd 5 p 4 6 p 5 7 gnd 8 p 6 9 p 7 10 p 8 11 p 9 12 v c c 13 gnd 14 p 10 15 p 11 16 u 6 ds39 00 1 2 d 3 g r e e n d2b r e d d2a j 4 j 3 ds3900 headers - pinout q 1 nmos external power must be supplied to vdut 100ma current limiting switch. 3.3v linear regulator, 150ma max usb tr ans ceiver. converts usb signals to logical signals. the high level for the logical signals is 3.3v. 48mhz oscillator 8-channel, bi-directional level translator. usb side has a xed 3.3v reference. pic side reference is the varying vdut reference. DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
maxim integrated 12 DS3900H2 revisions revisions yielding significant changes and/or improve - ments are tracked in firmware and displayed in most evaluation software provided by maxim integrated. revisions are broken up into a major and minor revision. for example, if the DS3900H2s revision is 3.2, it returns a major revision of 3 and a minor revision of 2. knowing the revision allows the software to both utilize new functions that are not available in previous versions of the DS3900H2s firmware and to avoid using commands that are not present in prior versions. although there are no plans to change the firmware at this time, maxim integrated reserves the right to change the firmware at any time without notice. intended use the DS3900H2 module is intended only to be used to evaluate maxim integrateds circuits. all hardware, firm - ware, and any relative software is provided as is, without warranty of any kind, express or implied, including but not limited to the warranties of merchantability, fitness for a particular purpose, and noninfringement. in no event shall maxim integrated be liable for any claim, damages or other liability, whether in an action of contract, tort or otherwise, arising from, out of, or in connection with the hardware, firmware, and any relative software or the use or other dealings in the hardware, firmware, and any relative software. figure 8. DS3900H2 ev kit communications module pcb layouttop figure 9. DS3900H2 ev kit communications module pcb layoutbottom DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
maxim integrated 13 # denotes an rohs-compliant device that may include lead(pb), which is exempt under the rohs requirements. part type DS3900H2evkit# ev kit communications module ordering information DS3900H2 www.maximintegrated.com usb hid communications module for evaluation kits
? 2013 maxim integrated products, inc. 14 revision number revision date description pages changed 0 6/13 initial release revision history maxim integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a maxim integrated product. no circuit patent licenses are implied. maxim integrated reserves the right to change the circuitry and specifcations without notice at any time. maxim integrated and the maxim integrated logo are trademarks of maxim integrated products, inc. DS3900H2 usb hid communications module for evaluation kits for pricing, delivery, and ordering information, please contact maxim direct at 1-888-629-4642, or visit maxim integrateds website at www.maximintegrated.com.

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